Building reliable, high-speed memory interfaces target FPGA I/O structures as well as intellectual property (IP) used within design software to allow rapid configuration of memory interfaces. These ...

The power struggle between DDR2 and DDR3 continues the tradeoff game between bandwidth and latency. The timing shifts required by the DDR3 flyby topology change the time at which byte lanes demand ...

As embedded systems take on more sophisticated applications, they also require advanced external memory systems, such as DDR3, in order to offer adequate throughput. At times it can be very helpful to ...

As stated in the DDR / DDR2 HEXUS.help guide, random access memory (RAM) is commonly one of the first places to look when contemplating a system upgrade. Today, that upgrade for many users may revolve ...

So here's where we end up at the doorsteps of G.Skill. Recently they introduced a pretty high-end triple channel DDR3 memory kit. The kit is available under SKU code F3-16000CL9T-3GBPI-B, and is short ...

So the memory kit tested today comes from Corsair's Vengeance series armed with ICs all packed nicely under a stylish aluminum heat spreader sitting on top of the DIMM module. Here are its ...