A new technical paper, “3D optoelectronics and co-packaged optics: when solving the wrong problems stalls deployment,” by the ...

Interpretable Parameter Effects Analysis,” was published by the University of Florida. Abstract “Analog-mixed-signal (AMS) ...

A new technical paper, “Agent Factories for High Level Synthesis: How Far Can General-Purpose Coding Agents Go in Hardware ...

A new technical paper, “Quantifying the Global Impact of Constraint Programming Based Local Scheduling in Semiconductor Manufacturing,” was published by Infineon and the University of Klagenfurt.

A new technical paper, “Reliability of Wide Bandgap Semiconductors for Automotive Applications,” was published by the ...

A new technical paper, “Device/circuit simulations of silicon spin qubits based on a gate-all-around transistor,” was ...

D hard mask material; defect identification; extreme photonic packaging.

Scaling logic continues to deliver better performance per watt, but it's becoming harder, more expensive, and increasingly customized.

If designers can verify individual blocks before subsystem integration, the verification team can focus on complex ...

Engineers must now ensure that silicon itself defends against attacks, protects embedded secrets, and complies with ...

Any software that claims to be independent from hardware is inefficient, bloated software. The time for such software development is over.

High-speed data movement will be required in future vehicles, probably including optical, but challenges persist.